SIA CESA 2025 Congress - Call for Papers

For over a decade, the SIA CESA congress has been the biennial gathering allowing all electronics and software stakeholders to share the latest state-of-the-art and innovative achievements arising from it. In line with this, and with the support of our manufacturing and equipment member companies, we have chosen to focus the next edition on the dual theme of the vehicle designed around software (Software Defined Vehicle) and new electronic architectures.

The call for papers is open until June 25, 2024, on the following themes:

1. EE Architecture

a. Centralized architectures (HPC, Zonal, networks)

b. Software driven components (SoC, Chiplets, Risc V, …)

c. On-board power : distribution (e-Fuses/SmartMOS, 48V, …)

2. SDV

a. Software architecture (inc. micro services, on & off-board)

b. Simulation tools

c. Development tools and processes

d. Cybersecurity

e. Data management (on & off board)

Abstracts can be uploaded to the dedicated congress platform at the following address: martin.pierrelee@sia.fr

In addition to the conferences, the congress features an exhibition area. Companies wishing to exhibit are invited to contact adelaide.evra@sia.fr.